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Detail Roadmap

FPCB MFG Process Ability Upgrade

2013 2014 2015
Classification Items Mass Product Proto Type Mass Product Mass Product
Structure Layers MLB 6L 6L 8L Over 10L
R-FPCB 8L 8L 10L Over 12L
Board
Thickness
MLB 0.45T(18mil) 0.65T(26mil) 0.65T(26mil) 0.65T(26mil)
R-FPCB 0.65T(26mil) 0.65T(26mil) 0.75T(30mil) 0.75T(30mil)
Specifications Line/
Space
Inner 50/50㎛
(2.0/2.0mil)
45/45㎛
(1.8/1.8mil)
45/45㎛
(1.8/1.8mil)
30/30㎛
(1.2/1.2mil)
Outer 50/50㎛
(2.0/2.0mil)
50/50㎛
(2.0/2.0mil)
45/45㎛
(1.8/1.8mil)
45/45㎛
(1.8/1.8mil)
Via Hole Mechanical 0.1Φ(4mil) 0.75Φ(3mil) 0.75Φ(3mil) 0.75Φ(3mil)
Laser 0.75Φ(3mil) 0.05Φ(2mil) 0.5Φ(2mil) 0.5Φ(2mil)
Solder Mask Conventional PSR4000 EFB30(BLUE : TAIYO), DSR-8000 S8-15(GREEN : TAMURA),
SPI-606G(BLACK : SEOUL Chem), NPR-80 ID120YR-HF(YELLOW : NIPPON POLYTECH)
Via Filling Copper Fill Copper Fill Copper Fill Copper Fill
Surface Finish ENIG, FENIG, ENEPIG, OSP, Electrolytic Soft gold, Direct gold