Products > Build-up FPCB

Build-up FPCB

Build Up FPCB

Available high-density and  multi-layer using Laser Drill Using Micro via hole Increasing efficiency of thickness and extent Apply for mobile phone

Item Capability
Min Line/Space 50㎛/50㎛
Min HoldDiameter 100㎛
Land Diameter Hole Dia. +200㎛